Description

Infinity Bond EP H20S Epoxy Syringes Pre-Mixed and Frozen

Infinity Bond EP H20S Epoxy Syringes Pre-Mixed and Frozen Overview

Infinity Bond EP H20S is a silver-filled epoxy system designed specifically for chip bonding using die stamping & dispensing techniques in microelectronic and optoelectronic applications. it is used for thermal management applications due to its high thermal conductivity. It is used for opto-electronic packaging material – LED, LCDs, and fiber optic components.

EP H20S is suggested for plastic IC packaging, high power devices, and high current flow, high power LEDs. It is also recommended for use in high-speed epoxy chip bonding. It is easy to apply by dispensing, screen printing, die-stamping or by hand.  

Sizes Available

Premixed syringes: Packaged in 3cc, 5cc, and 10cc disposable syringes. Syringes are shipped on dry ice at -80°C.

Alternative to EPO-TEK® H20S

Infinity Bond EP H20S is a direct replacement for EPO-TEK® H20S epoxy adhesive. If you have questions about switching from EPO-TEK® H20S to Infinity Bond EP H20S, don’t hesitate to contact us. 

Specifications