Infinity Bond EP H70E Epoxy Syringes Pre-Mixed and Frozen
Infinity Bond EP H70E Epoxy Syringes Pre-Mixed and Frozen
Infinity Bond EP H70E is a two-component, thermally conductive, electrically insulating epoxy designed for chip bonding in microelectronic and optoelectronics applications.
Features & Applications
Heat-sinking adhesive recommended for thermal management applications where good heat dissipation is necessary.
Outstanding handling characteristics and long pot life at room temperature. No solvents added.
This product can be screen printed, machine dispensed, stamped, or hand applied.
Die-attach adhesive designed to be used in the 300C range to resist TC wire bonding operations.
Excellent adhesion to ferrous and non-ferrous metals, lead-frame die paddle, glass, ceramic, kovar, and PCB.
Can be cured very rapidly, excellent material to use for making fast circuit repairs; can be snap-cured for in-line semiconductor die-bonding.
Sizes Available
Pre-mixed syringes: 3cc, 5cc, 10cc, 30cc. Syringes are shipped on dry ice at -80°C.
Alternative to EPO-TEK® H70E
Infinity Bond EP H70E is a direct replacement for EPO-TEK® H70E epoxy adhesive. If you have questions about switching from EPO-TEK® H70E to Infinity Bond EP H70E, don’t hesitate tocontact us.
